Faculty

Engineering

Supervisor Name

Andrew N. Hrymak

Keywords

PP-g-MA, GNP, Sonication, Polymer, Melt Blending

Description

Over the past few years, polymer products have become essential to our lives. Many people may think that polymers are simply plastics, however, that is just the tip of the iceberg. Polymer products are used in food, sport, medical, and technological industries. There have been numerous applications in all these areas, but in the technological industry, electronic devices, in particular, are affected by electrostatic discharge (ESD) generated by friction during handling, packaging, or transportation. This requires the use of antistatic packaging, a special package that has low electrical resistivity in order to avoid electron accumulation.

This study is an attempt to address this knowledge gap by use of compatibilizer approach & filler system to deliver high value improvements to microinjection molded parts.

Acknowledgements

Thank you Dr. Andrew N. Hrymak, the Western USRI program, and the faculty of Engineering for their support.

Creative Commons License

Creative Commons Attribution-Noncommercial 4.0 License
This work is licensed under a Creative Commons Attribution-Noncommercial 4.0 License

Document Type

Poster

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Improving Electrical Properties of Polypropylene/GNP composites Using Compatibilizer and Solvent-Assisted Melt Blending

Over the past few years, polymer products have become essential to our lives. Many people may think that polymers are simply plastics, however, that is just the tip of the iceberg. Polymer products are used in food, sport, medical, and technological industries. There have been numerous applications in all these areas, but in the technological industry, electronic devices, in particular, are affected by electrostatic discharge (ESD) generated by friction during handling, packaging, or transportation. This requires the use of antistatic packaging, a special package that has low electrical resistivity in order to avoid electron accumulation.

This study is an attempt to address this knowledge gap by use of compatibilizer approach & filler system to deliver high value improvements to microinjection molded parts.

 

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